Internship Germany
AI Summary
Internship Germany CTO Office - Nürnberg Join Ranovus for an Internship or to complete your Bachelor’s or Master’s thesis. Location: Nuremberg, Germany [Hybrid] Company: Ranovus – Innovating the Future of Data Centre Connectivity About Us At Ranovus, we’re powering the next generation of data centre infrastructure with cutting-edge fiber-optic communication technologies.
About this role
Internship Germany
CTO Office - Nürnberg
Join Ranovus for an Internship or to complete your Bachelor’s or Master’s thesis.
Location: Nuremberg, Germany [Hybrid]
Company: Ranovus – Innovating the Future of Data Centre Connectivity
About Us
At Ranovus, we’re powering the next generation of data centre infrastructure with cutting-edge fiber-optic communication technologies. With operations in Ottawa (Canada), Nuremberg (Germany), and San Jose (USA), we’re on a mission to deliver high-performance solutions that reduce environmental impact through lower power consumption.
What We Are Offering
We offer students a unique opportunity to gain hands-on experience with advanced technologies for optical and electronic systems, including heterogeneous integration, chiplet architectures, high-speed interconnect technologies. Interns will contribute to real development projects while working closely with experienced engineers and researchers.
The ideal candidate is pursuing a Bachelor's or Master's degree in Physics, Optical Systems, Electrical Engineering, Mechatronic, or a related field. Knowledge of engineering software such as ANSYS (Zemax), COMSOL, SolidWorks, MATLAB, Python, or equivalent simulation and design environments is beneficial.
Additionally, we are open to supporting students in completing their Bachelor’s or Master’s thesis at Ranovus, based on an industry-relevant topic.
The intern will contribute to several of the following activities:
Evaluation of advanced packaging architectures for photonic and electronic integrated circuits:
- Analysis of assembly tolerances and alignment requirements for photonic devices.
- Thermal modeling and assessment of package concepts, including liquid cooling solutions.
- Development of test methodologies and characterization setups.
- Support of package design activities using CAD and simulation tools.
- Participation in reliability studies including thermal cycling, power cycling, and environmental testing.
Benefits
- International work environment
- Innovative, research-driven projects in optical and electronic packaging
- Direct involvement in real development projects with impact
- Structured mentoring and feedback, with the option for long-term collaboration (e.g. follow-up internship, thesis, or entry position)
- Competitive internship compensation in line with your qualifications and study level
