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Eliyan

Posted 8 months ago

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Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal

Bay AreaOn-siteFull-time

AI Summary

Senior/Staff Packaging Engineer specializing in electro-thermal simulation to develop thermal and electrical models for 2.5D/3D IC packaging, chiplets, and advanced heterogeneous integration in support of high-performance computing applications.

About this role

Join the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team. You will develop comprehensive thermal and electrical simulations for next-generation semiconductor packaging solutions, including 2.5D/3D IC integration, chiplet-based systems, and advanced heterogeneous integration technologies. This role is critical in enabling high-performance computing, AI accelerators, and advanced chiplet architectures. We offer a fun work environment with excellent benefits. ONSITE M-F

Key Responsibilities:

  • Develop detailed thermal models for 2.5D/3D IC packages, chiplets, and multi-die systems; perform steady-state and transient thermal analysis with hotspot identification
  • Execute power integrity (PI) and IR drop analysis; optimize power distribution networks (PDN) and power delivery architectures
  • Conduct electromigration (EM) and reliability analysis for interconnects, bumps, TSVs, and redistribution layers (RDL)
  • Develop chip-package co-simulation workflows using industry-standard EDA tools (ANSYS RedHawkSC, RHSC-ET, SIwave, Cadence Sigrity/Clarity)
  • Create hierarchical compact macro models (CMM) and reduced-order thermal models for earlystage design optimization
  • Automate simulation workflows using Python, TCL, and Shell scripting; build design space exploration tools
  • Collaborate with silicon design, package design, and manufacturing teams on design-for-reliability (DFR) initiatives
  • Support customer engagements with technical analysis and present findings to stakeholders

    • Minimum Qualifications:

    • Education:
  • PhD in Electrical/Mechanical Engineering, or related field with focus on thermal management, power delivery, or electronic packaging (Master's with 5+ years experience considered)
  • Strong academic background in power integrity, signal integrity, and thermal management for advanced packaging
    • Technical Skills:
  • Expert proficiency in: ANSYS RedHawk-SC, RHSC Electrothermal, Totem, PathFinder, SIwave, HFSS, Q3D; Cadence Voltus, Sigrity, Clarity; Synopsys RedHawk Fusion, PrimeTime, ICC2
  • Experience with physical design tools (Cadence Innovus, Synopsys ICC2, Siemens Calibre) and RTLto-GDSII flows
  • Strong programming/scripting: Python, C/C++, Tcl, Shell (bash); Verilog/VHDL/SystemVerilog for verification
  • Knowledge of advanced packaging: 2.5D/3D ICs (CoWoS, InFO, EMIB), chiplets, TSVs, interposers, FOWLP, RDL design
    • Domain Expertise:
  • Deep understanding of EM/IR analysis, power integrity, thermal physics, and electrothermal cosimulation
  • Expertise in heat transfer principles (conduction, convection, radiation), thermal material properties, and CTE mismatch
  • Knowledge of chiplet standards (UCIe and BoW), die-to-die interfaces, and wafer-scale integration
  • Hands-on experience with semiconductor package thermal/electrical analysis and tape-outs

    • Ideal Qualifications:

  • Familiarity with machine learning applications in EDA and design optimization
  • Experience with HPC, AI/ML accelerator packaging, or co-packaged optics (CPO)
  • Background in reliability testing (thermal cycling, HTOL, THB) and measurement correlation

    • What we are looking for:

  • Strong analytical mindset with expertise across multiple physics domains (thermal, electrical, mechanical)
  • Excellent communication skills to present complex technical concepts to diverse audiences
  • Cross-functional collaboration abilities to work with silicon, package, product, and manufacturing teams
  • Self-motivated professional who thrives in fast-paced environments with minimal supervision
  • Continuous learner staying current with emerging technologies; innovation-driven with creative problem-solving
  • Results-oriented engineer delivering high-quality work to enable product milestones on schedule

    • Skills

    2.5D/3D ICANSYS RedHawk-SCBoWCadence InnovusCadence VoltusC/C++ClarityCoWoSElectrothermal Co-simulationEMIBHFSSICC2InFOPathfinderPrimeTimePythonQ3DRDLRHSC ElectrothermalShell (bash)Siemens CalibreSigritySIwaveSynopsys RedHawk FusionSystemVerilogTCLThermodynamicsTotemTSVUCIeVerilogVHDL

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