Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every chip. We are the rare unicorn that has grown fast and profitably. We received $515m in funding and are executing a multi-$B expansion plan for one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy.

We are seeking an on-site R&D Process Engineer to join our AI Chips team. This role will support customer prototyping and internal process development for advanced packaging applications, with a focus on integrating single-crystal diamond with AI customer devices to demonstrate thermal and performance benefits.

The ideal candidate is a hands-on process engineer with strong technical problem-solving skills, a collaborative mindset, and the ability to support fast-paced customer and internal development programs.

This position will be located in our San Jose office.

Responsibilities

Support customer prototyping projects to integrate single-crystal diamond with customer devices and demonstrate thermal and performance benefits.

Develop advanced packaging and bonding processes adaptable to diverse customer device designs, material stacks, package configurations, and integration requirements.

Evaluate, select, and optimize bonding technologies, including pressure/pressureless sintering, thermocompression, surface/plasma-activated bonding, and emerging methods.

Drive internal process development and validation, including cleaning, metallization, DOE-based bonding optimizations, process characterization, failure analysis, and reliability testing.

Manage end-to-end project execution, covering schedules, technical risks, cross-functional communication, customer updates, and technical reports.

Requirements

Bachelor’s or advanced degree in materials science, electrical engineering, chemical engineering, or a related field.

Experience in semiconductor packaging, advanced materials, process engineering, device integration, or related technical development is preferred.

Familiarity with bonding, thin-film deposition, surface preparation, metrology, failure analysis, reliability testing, or similar process technologies is desirable.

Strong problem-solving skills and willingness to learn new materials, tools, and processes.

Good communication skills and ability to work effectively with cross-functional teams, hands-on, detail-oriented, motivated, and comfortable working in a fast-paced development environment.

R&D Process Engineer, Advanced Bonding Process Development

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