Open since Jul 2026
2027校招-工艺工程师/Process EngineerTexas Instruments · Chengdu
2027校招-工艺工程师/Process Engineer
ChengduOn-siteFull-time
AI Summary
Supports and optimizes semiconductor manufacturing process standards across wafer fabrication, wafer test, packaging and bumping, including process parameters, production anomalies, pre-production monitoring and new process development.
About this role
亲爱的同学,想见证并参与一颗芯片的诞生之路吗?对芯片制造感兴趣的同学,德州仪器半导体制造成都有限公司(TI)给你提供了一个富有挑战和有意义的机会!
职位描述
作为TI的工艺工程师,你将:
- 学习并掌握半导体制造工艺流程(晶圆制造/晶圆测试/封装测试/凸点加工)
- 协助工艺工程师完成和优化芯片制造工艺标准,撰写工艺文件,定义工艺参数,处理生产异常;
- 通过提高工艺稳定性,优化产品质量,降低生产成本,提升制造产能和产品的市场竞争力;
- 负责新产品量产前工艺监控,提前发现问题并采取预防措施;负责新工艺开发,突破现有工艺瓶颈。
Qualifications
我们在寻找
- 2027年毕业生(25-26年毕业生,工作经验少于24个月也可投递),本科/硕士学历,理工科专业(电力电子/材料/物理/化学等专业优先)
- 具备良好的逻辑分析能力/数据敏感度
- 良好的问题分析和独立思考能力
- 积极主动,具有团队合作精神;较强的人际交往及沟通能力
- 良好的英语听说能力
Skills
BumpingData AnalysisNew Process DevelopmentPackaging And TestProcess ControlProcess DocumentationProcess Parameter DefinitionRoot Cause AnalysisSemiconductor Manufacturing ProcessesWafer FabricationWafer TestYield Optimization
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