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Diamond Foundry

Posted 14 days ago

Application Engineering DirectorDiamond Foundry · Bay Area

Application Engineering Director

Bay AreaOn-siteFull-time

AI Summary

Leads the application engineering function integrating single-crystal diamond into semiconductor devices, owning bonding strategy, process development, and customer programs from prototype through high-volume manufacturing. Also presents technical strategy and risks to executives and customers.

About this role

Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every chip. We are the rare unicorn that has grown fast and profitably. We received $515m in funding and are executing a multi-$B expansion plan for one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy.

Diamond Foundry is seeking an experienced Director of Application Engineering to lead how our single-crystal diamond is integrated into semiconductor devices, with a focus on advanced bonding and packaging. As the world’s leading producer of lab-grown diamond, we are growing our application engineering team to support semiconductor and AI chip customers who need better thermal performance. This role owns the technical bonding strategy and turns it into customer programs, roadmaps, and paths to production.

The ideal candidate is a recognized bonding and advanced packaging expert who can still go hands-on in the lab and can also present technical strategy, risks, and tradeoffs to executive leadership and customers. You can move a process from early prototype through qualification to high-volume manufacturing, and you can build a team that does the same.

Responsibilities

  • Lead and grow the application engineering function, setting the technical direction for bonding single-crystal diamond to customer devices in advanced packaging and thermal management applications.
  • Own the bonding technology strategy, including how we evaluate, select, and optimize pressure and pressureless sintering, thermocompression, surface/plasma-activated, hybrid, and emerging bonding methods across different device designs and material stacks.
  • Direct process development and validation, including surface preparation, metallization, DOE-based optimization, characterization, failure analysis, and reliability testing.
  • Serve as the senior technical lead on customer programs, from prototyping through qualification, technology transfer, and scale-up to mass production.
  • Partner with executive leadership, R&D, product, and business development on product roadmaps, resourcing, and new application opportunities, with clear reporting on schedules, technical risks, and results.
  • Present technical results and strategy to customers, executives, and industry partners.

    • Requirements

  • Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field; Master’s or PhD preferred.
  • 10+ years of experience in semiconductor packaging, process engineering, or thermal management, including 3+ years leading engineering teams or programs.
  • Deep, hands-on expertise in wafer/die bonding technologies and the related processes: surface preparation, thin-film metallization, metrology, failure analysis, and reliability testing.
  • Strong understanding of advanced packaging architectures (2.5D/3D IC, CoWoS, flip-chip, fan-out) and their thermal management challenges.
  • Proven record of taking bonding or packaging processes from R&D through qualification and into high-volume manufacturing, including technology transfer to customers or OSATs.
  • Excellent communication and executive presence; able to translate complex technical issues into clear business decisions for management and customers.
  • Experience with high-thermal-conductivity materials (diamond, SiC, or similar) is highly desirable.

    • Skills

    2.5D/3D ICAdvanced PackagingCoWoSDie BondingDOEFailure AnalysisFan-out PackagingFlip-chipHybrid BondingMetrologyPressureless SinteringReliability TestingSingle-crystal DiamondSurface Activated BondingThermal ManagementThermocompression BondingThin-film MetallizationWafer Bonding

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