Posted 3 months ago
Bonding/RDL routing/Package Interface
AI Summary
The incumbent will define bonding/RDL routing/package interface strategies, perform decap analysis, and drive switch cell distribution and IR/IVD/EM analysis with fix implementation.
About this role
Bonding/RDL routing/Package Interface
Greeting!!
Aarna HR Solutions is a Human Resource Recruitment Company providing services to Various IT, ITES and Non- IT companies across India. Aarna HR Solutions strive towards hiring the best and the brightest talent in the industry. We hire individuals with a strong sense of pride in their performance, team spirit, and a desire to excel.
We have immediate openings for “Bonding/RDL routing/Package Interface" for our Semiconductor client located in Bangalore.
About Position
Position: Bonding/RDL routing/Package Interface
Experience: 3+ Years
Location: Bangalore
Qualification: BE/ B Tech/ M tech
Job Description
- Bonding/RDL routing/Package Interface
- Power Strap Definition
- Decap Analysis
- Switch Cell Distribution strategy
- IR/IVD/EM analysis & fix strategies
If interested please send your UPDATED Profile with below mentioned details.
Current CTC:
Expected CTC:
Notice Period:
Reason for Job Change:
With Regards,
Harshitha- HR Recruiter
Aarna HR Solutions Pvt Ltd
Mob No: 9036516137;
Additional Information
All your information will be kept confidential according to EEO guidelines.
Skills
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