Device Characterization Engineer

onsemi is seeking a highly motivated Semiconductor Device Characterization Engineer at Hopewell Junctions, New York. to support high-volume manufacturing and new technology development activities. Expertise in trench MOSFET and/or IGBT is desired. This role serves as a critical technical resource for electrical characterization, data analysis, process evaluation, and manufacturing decision support during non-standard operating hours, providing rapid response to production and quality issues.

The successful candidate will leverage device physics knowledge, statistical analysis, and electrical characterization expertise to evaluate product performance, disposition manufacturing holds, assess process changes, and drive timely technical decisions that maintain product quality and manufacturing continuity.

Qualifications

Required Qualifications

• B.S. or M.S. in Electrical Engineering, Semiconductor Engineering, Physics, Materials Science, or a related technical discipline.
• Minimum 2+ years of experience in semiconductor device engineering, characterization engineering, product engineering, or a related role.
• Strong understanding of power semiconductor device physics and operation
• Experience analyzing manufacturing and characterization datasets for device performance assessment and process monitoring.
• Demonstrated experience evaluating manufacturing excursions through FMEA and making technically sound disposition decisions.
• Strong understanding of semiconductor fabrication processes and their impact on device electrical performance.
• Experience with electrical characterization equipment and semiconductor parametric measurement techniques.
• Knowledge of statistical analysis tools and methodologies.
• Excellent problem-solving, root-cause analysis, and decision-making skills.
• Strong written and verbal communication skills.

Preferred Qualifications

• M.S. or Ph.D. in Electrical Engineering, Physics, or a related field.
• Experience supporting high-volume semiconductor manufacturing operations.
• Familiarity with reliability qualification standards and methodologies.
• Experience with wafer acceptance testing, process control monitoring, and electrical yield analysis.
• Working knowledge of TCAD simulation or device modeling tools.
• Experience using JMP, Minitab, Python, MATLAB, SQL, Spotfire, or similar data analytics platforms.
• Knowledge of automotive, industrial, or high-reliability power semiconductor products.
• Experience with 300 mm power semiconductor manufacturing environments.

Responsibilities

• Electrical characterization activities for trench MOSFET, IGBT, and related power semiconductor technologies.
• Analyze parametric, probe, final test, reliability, and failure analysis data to identify trends, excursions, and process-induced performance shifts.
• Provide technical assessment and disposition recommendations for manufacturing lot holds, process deviations, and electrical outliers.
• Serve as the primary engineering resource for rapid investigation of production issues requiring immediate technical evaluation.
• Evaluate the impact of process changes, equipment modifications, material changes, and process excursions on device performance and reliability.
• Develop and execute characterization plans to support process qualification, technology transfers, and continuous improvement initiatives.
• Correlate wafer sort, package test, reliability, and device characterization data to determine root causes of electrical performance variations.
• Collaborate with process integration, device engineering, yield engineering, quality, reliability, test engineering, and manufacturing teams to resolve issues and drive corrective actions.
• Perform statistical analysis using large datasets to identify yield detractors and opportunities for process optimization.
• Actively monitor and react to key device parameters
• Generate concise technical reports and communicate findings, risks, and recommendations to management and cross-functional teams.
• Support reliability investigations and customer-facing quality issues when device characterization expertise is required.
• Drive implementation of automated data analysis and characterization methodologies to improve engineering response times.