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Die Attach Process EngineerTexas Instruments · Melaka

Die Attach Process Engineer

MelakaOn-siteFull-time

AI Summary

Drives process and procedure improvements in a 300mm analog wafer fab, supporting manufacturing operations, lot and equipment dispositions, ramp activities and problem resolution with a focus on die attach.

About this role

Change the world. Love your job.
Texas Instruments is looking for an energetic engineer with a passion for process. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed, highly motivated engineer to join our team.


The responsibilities of a Manufacturing Process Engineer in this role include:

  • Support manufacturing operations
  • Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
  • Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
  • Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
  • Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner
  • Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
  • Participate in data analysis and problem resolution

Qualifications

Minimum requirements:

  • 5 years relevant experience
  • Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
  • Strong foundation in statistical process control, engineering change control and process release strategies
  • Experience in Die Attach process would be an added advantage


Preferred qualifications:

  • Demonstrated strong analytical and problem solving skills
  • Strong verbal and written communication skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Strong time management skills that enable on-time project delivery
  • Demonstrated ability to build strong, influential relationships
  • Ability to work effectively in a fast-paced and rapidly changing environment
  • Ability to take the initiative and drive for result

Skills

300mm Wafer FabAnalog TechnologiesData AnalysisDie AttachEngineering Change ControlEquipment StartupLot DispositionProblem SolvingProcess ExperimentsProcess Release StrategiesStatistical Process ControlYield Improvement

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