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Die Attach Process EngineerTexas Instruments · Melaka
Die Attach Process Engineer
MelakaOn-siteFull-time
AI Summary
Drives process and procedure improvements in a 300mm analog wafer fab, supporting manufacturing operations, lot and equipment dispositions, ramp activities and problem resolution with a focus on die attach.
About this role
Change the world. Love your job.
Texas Instruments is looking for an energetic engineer with a passion for process. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed, highly motivated engineer to join our team.
The responsibilities of a Manufacturing Process Engineer in this role include:
- Support manufacturing operations
- Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
- Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
- Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
- Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner
- Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
- Participate in data analysis and problem resolution
Qualifications
Minimum requirements:
- 5 years relevant experience
- Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
- Strong foundation in statistical process control, engineering change control and process release strategies
- Experience in Die Attach process would be an added advantage
Preferred qualifications:
- Demonstrated strong analytical and problem solving skills
- Strong verbal and written communication skills
- Ability to work in teams and collaborate effectively with people in different functions
- Strong time management skills that enable on-time project delivery
- Demonstrated ability to build strong, influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for result
Skills
300mm Wafer FabAnalog TechnologiesData AnalysisDie AttachEngineering Change ControlEquipment StartupLot DispositionProblem SolvingProcess ExperimentsProcess Release StrategiesStatistical Process ControlYield Improvement
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