Engineering Team Lead - Deposition and Etch

Job Summary

The Team Leader oversees daily team operations, talent development, and strategic execution to drive core business objectives within the deposition and etch cell.

• Team Leadership & Development: Guide daily operations, mentor team members, and foster professional growth.

• Operational Execution: Ensure high-quality, on-time delivery of team deliverables and project milestones.

• Process Optimization: Drive continuous improvement initiatives to enhance efficiency and workflows.

• Strategic Collaboration: Partner with cross-functional stakeholders to align team goals with broader business strategy.

Responsibility

Team Leadership & People Management

• Direct Team Oversight: Lead, mentor, and develop a team of process engineers, technicians and cleanroom associates focused on deposition and etch operations within a high-specification semiconductor cleanroom.

• Goal & Performance Alignment: Set clear, measurable KPIs and deliverables aligned with customer milestones, conducting robust performance reviews and coaching to build operational resilience across multiple concurrent projects.

• Capability & Skills Development: Own the cell’s technical training and skills matrix to ensure sustained engineering capacity, adaptability, and career progression.

• Culture & Collaboration: Champion core behavioural standards, fostering an inclusive, high-collaboration, and innovative culture across cross-functional engineering and manufacturing teams.

Technical Execution & Process Engineering

• Advanced Cell Operations: Oversee process development and baseline stability for deposition and etch modules, specializing in precision III-V semiconductor materials.

• Tool & Recipe Development: Direct recipe development, optimization, and failure analysis utilizing RIE, ICP-RIE, PECVD, ALD, SEM, and FIB-SEM platforms.

• New Equipment & Technology Integration: Lead the qualification, installation, and baselining of new capital equipment and advanced process technologies alongside comprehensive standard operating documentation.

Quality, Data & Continuous Improvement

• Quality-First Framework: Embed a "quality first" standard across all product lifecycle stages, enforcing rigorous cleanroom safety protocols, change control and Out-of-Control Action Plans (OCAPs).

• Data-Driven Engineering: Drive empirical decision-making across the team using Design of Experiments (DoE), Statistical Process Control (SPC), Gauge R&R, and advanced statistical analysis (e.g., Minitab).

• Structured Problem Solving: Facilitate rapid root cause analysis and resolution for complex yield and reliability issues using 8D, pFMEA, and mFMEA frameworks.

Strategy & Stakeholder Coordination

• Strategic Roadmap Alignment: Align deposition and etch cell capabilities with the overarching business goals, yield targets, and the long-term technical roadmap.

• Stakeholder Coordination: Partner with module leads, integration engineers, operations, and quality stakeholders to standardize best practices and scale technical innovations reliably across the fab.

Requirements

• Bachelor’s/Master’s/PhD in Materials Science, Physics, Semiconductor Technology, Engineering, or related field.

• 5+ years of semiconductor process engineering experiencein a high-specification cleanroom.

• 3+ years of technical team leadership/mentoringexperience, including KPI and skills management.

• Strong experience withIII-V materials(InP, GaAs, GaN) and semiconductoretch/deposition processes, including RIE, ICP-RIE, PECVD, and ALD.

• Hands-on experience withSEM/FIB-SEMfor process and failure analysis.

• Proven experience inprocess development, optimization, transfer, and equipment qualification/commissioning.

• Strong knowledge ofDoE, SPC, MSA/Gauge R&R, and quality tools such as8D, FMEA, QCP, and OCAP.

• Stronganalytical, communication, problem-solving, and cross-functional collaborationskills; able to work independently and under pressure.