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IO Module Engineer

AustinHybrid

AI Summary

Engineer responsible for the thermomechanical, electrical, and mechanical design and assembly of IO modules for A-0 and A-1 wafers, including signal integrity signoff and connector bringup.

About this role

What We’re Looking For:

We’re looking for engineers to contribute to the thermomechanical, electrical and mechanical design and assembly of the IO modules that attach to our A-0 and A-1 wafers.

Ideal Background:

  • Deep understanding and hands-on experience with signal integrity signoff for copper and electro-optic connector interfaces
  • Hands-on experience with mechanical aspects of electrical and electro-optic connectors
  • Experience with bringup of connectorized links and systems

Nice to Have:

  • Experience and understanding of sockets and socketed connectors
  • Experience with co-packaged copper and co-packaged optics
  • Experience with high density optical modules
  • Experience with XPO optical pluggable form factors

Skills

Connectorized Link BringupCo-packaged CopperCo-packaged OpticsCopper Connector InterfacesElectro-optic Connector InterfacesHigh Density Optical ModulesMechanical Design Of Electrical ConnectorsMechanical Design Of Electro-optic ConnectorsSignal Integrity SignoffSocketed ConnectorsXPO Optical Pluggable Form Factors

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