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E-Space

Posted 6 days ago

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Lamination Engineer

ArlingtonOn-siteFull-time

AI Summary

Lamination Engineer responsible for the assembly, interconnection, and lamination of thin-film materials in a sheet-to-sheet and roll-to-roll manufacturing setting, ensuring robust electrical and mechanical protection.

About this role

Ready to make connectivity from space universally accessible, secure and actionable? Then you’ve come to the right place!

E-Space is bridging Earth and space to enable hyper-scaled deployments of Internet of Things (IoT) solutions and services. We are building a highly-advanced low Earth orbit (LEO) space system that will fundamentally change the design, economics, manufacturing and service delivery associated with traditional satellite and terrestrial IoT systems.

We’re intentional, we’re unapologetically curious and we’re 100% committed to innovate space-based communications and deliver actionable intelligence that will expand global economies, protect space and our planet and enhance our overall quality of life.

We are seeking a skilled and detail-oriented Lamination Engineer to be responsible for assembly, interconnection, and lamination of thin-film materials in a sheet to sheet and a roll-to-roll (R2R) manufacturing environment.

What you'll be doing:

  • Develop and optimize dry and wet lamination and assembly processes

  • Operate lamination processes (hotmelt, adhesives, UV/thermal curing)

  • Develop encapsulation and coating stacks

  • Select and qualify materials for production

  • Apply and optimize protective coatings and encapsulation layers for environmental and mechanical protection.

  • Ensure electrical and mechanical robustness of the final product

  • Troubleshoot lamination and interconnection defects

  • Perform scale-up to production

  • Develop SOPs, work instructions, and process documentation for lamination and assembly operations.

What you will bring to this role:

  • BS or MS in Engineering or related field

  • Minimum 5 years of experience in lamination ideally with flexible electronics manufacturing.

  • Hands-on experience with thin-film device lamination and encapsulation.

  • Experience with flexible substrates and R2R systems

  • Familiarity with lamination materials such as adhesives, barrier films, and protective coatings.

  • Ability to work closely with production, quality, and equipment teams in a manufacturing environment.

Extra points for the following:

  • Experience with UVresistant encapsulation materials.

  • Background in lightweight, flexible electronics.

  • Familiarity with failure modes related to lamination, delamination, cracking, or interconnect fatigue.

Skills

AdhesivesBarrier FilmsCoating StacksDefect TroubleshootingDelaminationEncapsulationEnvironmental ProtectionFailure AnalysisFlexible Electronics ManufacturingHotmelt LaminationInterconnect FatigueLamination Process OptimizationMaterial QualificationMechanical RobustnessProcess DocumentationProtective CoatingsR2R SystemsSOP DevelopmentSubstrate HandlingThermal CuringThin-film LaminationUV Curing

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