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Mechanical Hardware Engineer

SingaporeOn-siteFull-time

AI Summary

Develops and qualifies mechanical hardware for HP LaserJet mono and color single-function and all-in-one printers, coordinating with OEM partners and internal teams on design, thermal management, and production release.

About this role

Mechanical Hardware Engineer

Description -

If you are our Mechanical Hardware Engineer in Singapore, you will have a chance to:

  • Be a member of the LaserJet Color/Mono Single Function and All-in-One development team located in Singapore.
  • The primary skills will center on LaserJet product design, development, qualification and coordination with part and mechanism vendors for Single Function (SF) and AiO products.
  • Responsible for the development of HP Mono and Color Laser Single Function Product (SFP)/Multi-Function Product (MFP) printer related to mechanical/electrical systems, coordinating between key internal asset owners and external partners.
  • Manage all engineering aspects of printers throughout the product lifecycle (including architecture, design requirements gathering, schedule, specifications, phase exit approvals, issues tracking, driving issue resolution/closure and release for production).
  • Investigate and evaluate technical options/countermeasures and represents the print engine team response to the cross functional teams that meets the business and technical requirements.
  • Work with original equipment manufacturer (OEM) partners to develop HP Mono and Color Laser SFP/MFP printer that meet schedule, quality, cost requirements and end to end customer experience.
  • Technical lead that drives the implementations effort for print engine and cartridge specification and qualification, partner with corporate Industrial Design initiatives and assist the development and execution of margin and specification test plans during development.

Are you a high performer? We are looking for an individual with:

  • Bachelor's or Master's degree in Mechanical Engineering.
  • Typically 6-10 years’ experience.
  • Using ProEngineer or other 3D CAD software as a mechanical design tool.
  • Strong analytical and problem-solving skills.
  • Strong understanding and experience in electronics packaging.
  • Designing sheet metal and plastic parts and associated production tooling and processes.
  • Using CFD and thermal mockups to validate thermal solution.
  • Ability to effectively communicate product architectures, design proposals and negotiate options at management levels.


Knowledge & Skills
• 3D Modeling
• Computer-Aided Design
• Electromechanics
• Engineering Design Process
• Finite Element Methods
• Injection Molding
• Machining
• Manufacturing Processes
• Mechanical Design
• Mechanical Engineering
• Mechanical Systems
• New Product Development
• Product Design
• Product Lifecycle Management
• Prototyping
• PTC Creo (CAD Suite)
• Sheet Metal
• Thermal Management

• Tolerance stack up analysis


Cross-Org Skills
• Effective Communication
• Results Orientation
• Learning Agility
• Digital Fluency
• Customer Centricity


Impact & Scope
• Impacts function and leads and/or provides expertise to functional project teams and may participate in cross-functional initiatives.

Complexity
• Works on complex problems where analysis of situations or data requires an in-depth evaluation of multiple factors.


Disclaimer
• This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.


Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (Singapore)

Travel -

25%

Relocation -

No

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’sEEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"

Skills

3D ModelingComputer-aided DesignElectromechanicsEngineering Design ProcessFinite Element MethodsInjection MoldingMachiningManufacturing ProcessesMechanical DesignMechanical EngineeringMechanical SystemsNew Product DevelopmentProduct DesignProduct Lifecycle ManagementPrototypingPTC CreoSheet MetalThermal ManagementTolerance Stack-up Analysis

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