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Photonics Packaging Engineer

AustinHybrid

AI Summary

Photonics Packaging Engineer responsible for A-0 and A-1 package design and ownership, bridging photonics and advanced packaging skills to integrate multiple dies and heterogeneous materials in photonic assemblies.

About this role

What We're Looking For:

We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages.

This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.

Ideal Background:

  • Experience with integrated photonics package assemblies with multiple dies
  • Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
  • Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.

Nice to Have:

  • Experience with large device count photonic assemblies
  • Experience with clear underfill
  • Experience with high density fiber attach
  • Experience with large substrate size photonic MCM assemblies
  • Hands-on experience with PIC design

Skills

Clear UnderfillCompound SemiconductorsHigh Density Fiber AttachIntegrated Photonics PackagingMCM AssemblyMode Field DiameterMode MismatchPhotonic MCM AssembliesPIC DesignPolarization

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