Posted 20 days ago
Principal Engineer, Research Science Engineering
AI Summary
Lead process integration engineer for next-generation mixed-signal and BCD semiconductor technologies, bridging device and fab engineers to define process specs, layout rules, and qualification efforts.
About this role
About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.
We are seeking an experienced process integration engineer with expertise in silicon device fabrication. You will be a lead contributor to the definition of new process technology integration specifications and layout design rules for ADI’s next-generation mixed-signal and BCD technologies. You will be interface between device engineers and fab process engineers and provide process integration solutions to device engineers. You will be responsible for identifying the root cause of yield and reliability issues incurred during the process development. You will also lead process and product qualification efforts for new technologies and for technologies transferring between different fabs.
Requirements
Successful candidates for this position will have:
- In-depth knowledge of FEOL/BEOL processes
- Strong knowledge of process DOE – screening /process corner
- Demonstrated ability to solve unique or complex integrated problems across processing modules
- Hands-on experience in test structure design, layout, test, and data analysis
- Knowledge of device physics and Si reliability characterization methodologies
- Understand the trade-off between cost, performance, yield, reliability.
- Strong project management skills - plan effectively, drive schedules, meet critical deadlines
- Excellent communication and collaboration skills. Expect to work closely with cross functional teams
- knowledge of packaging technology is a plus
- M.S./Ph.D. in Electrical Engineering, Physics, Material Science, or equivalent field with 7+ years semiconductor industry experience
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
EEO is the Law: Notice of Applicant Rights Under the Law.
Job Req Type: ExperiencedRequired Travel: Yes, 10% of the timeShift Type: 1st Shift/DaysThe expected wage range for a new hire into this position is $180,642 to $261,579.Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
Skills
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