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Principal Systems Packaging & Assembly Engineer

Santa ClaraOn-siteFull-time

AI Summary

Leads packaging and assembly development for MEMS-based silicon photonics optical switching platforms, bridging R&D and manufacturing to enable scalable, high-performance data center solutions.

About this role

About us

nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's OCS is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability.

Job Overview

We are seeking a Systems Packaging & Assembly Engineer to lead the development and integration of advanced packaging and assembly solutions for our MEMS-based silicon photonics switching platform.

This role sits at the intersection of device engineering, packaging architecture, manufacturing engineering, and supply chain, driving packaging solutions from concept through high-volume production.

The ideal candidate is a hands-on packaging expert with deep experience in optical modules, MEMS devices, semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional programs with OSATs, contract manufacturers, and internal engineering teams.

This is a highly visible role responsible for bridging R&D and manufacturing, ensuring that our packaging architecture enables scalable production of high-performance optical switching systems.

Key Responsibilities

Package Design & System Integration

  • Define and codesign package substrates for MEMS-based silicon photonics optical switching systems.

  • Lead package and assembly integration of complex multi-component systems which include MEMs devices, photonic ICs, ASICs, substrates, and optical interfaces.

  • Drive mechanical, electrical, and optical integration strategies to ensure system performance, reliability, and manufacturability.

  • Collaborate with photonics, MEMS, electrical, and mechanical teams to define packaging requirements and system interfaces.

    • Assembly Process Development

  • Optimize assembly processes including die attach, flip-chip, wire bonding, fiber attach/alignment, and hybrid integration.

  • Develop and implement fixtures, jigs, and tooling at our OSATs to support prototype builds and NPI.

  • Establish process flows, BOM structures, and manufacturing documentation for new products.

  • Identify opportunities for yield improvement, cost reduction, and cycle-time optimization.

    • NPI & Manufacturing Ramp

  • Lead New Product Introduction (NPI) activities from prototype builds through production ramp.

  • Work closely with OSAT partners, contract manufacturers, and suppliers to meet our product requirements.

  • Drive process qualification, yield ramp, and reliability validation.

  • Implement root cause analysis (RCA), corrective actions, and failure analysis workflows.

    • Supplier & Manufacturing Partner Management

  • Direct involvement with OSATs, substrate vendors, optics suppliers, and strategic partners.

  • Lead technology transfer from engineering to manufacturing partners.

    • Program Management

  • Act as a technical program manager for packaging and assembly development across multiple engineering teams.

  • Coordinate activities between device engineering, system engineering, manufacturing, reliability, and supply chain.

  • Track program milestones and ensure packaging readiness aligns with product development timelines.

    • Required Qualifications

  • Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.

  • 15+ years of experience in semiconductor or photonics packaging engineering.

  • Extensive experience in IC package design and back-end assembly process development in a manufacturing environment.

  • Strong background in advanced packaging technologies, such as:

  • Flip-chip and wirebond hybrid assemblies

  • BGA / FCBGA / CSP / WLCSP

  • Multi-die stacking (2.5D / 3D integration)

  • System-in-Package (SiP)

  • Proven experience driving NPI programs from concept to high-volume production.

  • Hands-on experience working with OSATs and contract manufacturers.

  • Strong knowledge of yield improvement, failure analysis, and process development.

  • Demonstrated ability to lead projects and guide engineers as a senior technical contributor.

  • Hands-on expertise with die bonders, dispensers, reflow/TCB tools, wirebonders, and interface metrology (CSAM, X-ray, AOI).

  • Strong background in materials characterization and statistical process control (DOE, FMEA, SPC)

    • Preferred Experience

  • Experience with fiber attach and photonic IC packaging.

  • Background in optical transceivers, co-packaged optics, or photonics modules.

  • Experience with optical modules, photonics packaging, and/or MEMS devices.

  • Experience with optical alignment and hermetic packaging solutions.

  • Six Sigma certified

  • Familiarity with substrate layout tools and packaging design environments (Cadence SiP, AutoCAD, SolidWorks, etc.)

    • Skills

    2.5D3D IntegrationAOIAutoCADBGACadence SIPCSAMCSPDie BonderDOEFCBGAFiber AttachFlip ChipFMEAMEMS PackagingOSATPhotonic IC PackagingReflowSIPSix SigmaSolidWorksSPCTCBWirebondWirebondersWLCSPX-rayYield Improvement

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