Posted 3 months ago
Process Engineer, IC Device Assembly Operations
AI Summary
Process Engineer responsible for wire bonding operations in IC device assembly, optimizing processes and ensuring quality and throughput.
About this role
Process Engineer, IC Device Assembly Operations
Zenith Talent specializes in staffing professional positions in Information Technology, Engineering, Marketing, Sales, Finance, HR and Operations. We have the knowledge and skills to supply candidates that fit perfectly in your organization. As a minority owned company, we understand the benefits of a diverse workforce, which is why we have built strong alliances with many diverse organizations, directly linking their members to opportunities within your organization.
Minimum qualifications
BSME, BSEE
Responsibilities
Process Engineer, Wire Bonding Operations
Additional Information
If our requirement matches your resume, then please do reply on my email id "williamb(at) zenithtalent (dot) com" or call me on 408-520-9675
Skills
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