Posted 9 days ago
R&D Test Engineer, Thermal/Mechanical/Reliability
AI Summary
Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless.
About this role
We are seeking an on-site R&D Test Engineer to join our AI Chips team. This role will work closely with the thermal/mechanical/reliability lead to execute thermal testing, coordinate reliability testing, design and develop custom test hardware and fixtures for customer prototyping of single-crystal diamond applications on AI customer chips, and generate engineering insights that guide customer engagements and product development.
The ideal candidate is a hands-on thermal or mechanical engineer with strong technical problem-solving skills, a collaborative mindset, and the ability to support fast-paced customer and internal development programs.
This position will be located out of our San Jose office.Responsibilities
Support customer prototyping projects through design and development of mechanical fixtures and experimental apparatus using CAD software, and coordinate fabrication with internal and external machine shops.
Coordinate accelerated lifetime reliability testing and environmental stress testing per industry standards to validate long-term performance and durability of SCD-on-silicon attachment methods, package integrity.
Design, build, operate, and troubleshoot thermal characterization test platforms to evaluate SCD thermal solutions on thermal test vehicles (TTVs) and customer hardware.
Develop assembly processes for prototype hardware, including thermal interfaces, mounted cooling solutions, and instrumentation integration as needed.
Manage project schedules, technical risks, cross-functional communication, customer updates, and technical reports.
Requirements
Degree & Experience: BS or MS in Mechanical Engineering or a related discipline, with 2+ years of experience in mechanical/thermal engineering, test engineering, or product development.
Thermal & Reliability Testing: Experience with laboratory instrumentation and data acquisition systems (Preferred: thermal testing/characterization for packaged devices, liquid cooling solutions like fans/cold plates, and reliability/environmental stress testing).
Software & Simulation: Proficiency with CAD software (SolidWorks preferred) (Preferred: familiarity with FEA and CFD tools such as ANSYS Mechanical/Fluent, Icepak, or COMSOL).
Data Analysis & Fabrication: Experience creating engineering drawings to support fabrication, alongside data processing and analysis using MATLAB, Python, Excel, JMP, or similar tools (Preferred: familiarity with IC packaging, metrology, or failure analysis).
Professional Attributes: Strong problem-solving and communication skills, with a hands-on, detail-oriented mindset, comfortable working cross-functionally in a fast-paced R&D environment.