Senior Principal Engineer, Mechanical Engineering

Job's mission

Role Overview

The Senior Principal Electrical Engineer is the highest-level technical authority for electrical architecture and technology strategy across advanced packaging semiconductor equipment platforms. This role defines long-term electrical technology roadmaps, drives cross-business innovation, governs system architecture decisions, and serves as the subject matter expert for RF systems, controls, power delivery, EMC/EMI, grounding, functional safety, and next-generation tool development.

Key Responsibilities

• Own enterprise-level electrical architecture strategy across multiple semiconductor equipment platforms.

• Define technology roadmaps for RF power systems, power distribution, motion control, safety systems, sensors, and advanced electronics.

• Lead architecture governance and executive design reviews (SRR, PDR, CDR).

• Drive innovation, intellectual property creation, and technology differentiation.

• Provide technical leadership for critical customer escalations and complex field issues.

• Establish electrical engineering standards, design methodologies, and best practices.

• Lead cross-functional teams spanning systems, process, mechanical, software, manufacturing, and suppliers.

• Own EMC/EMI, grounding, CE/UL, SEMI, and global compliance strategies.

• Mentor principal engineers and develop organizational technical capability.

• Influence product strategy, new platform development, and corporate technology investments.

Required Qualifications

• MS or PhD in Electrical Engineering or related discipline preferred.

• 15+ years of semiconductor capital equipment experience.

• Recognized expert in RF systems, power electronics, motion control, safety systems, or tool electrical architecture.

• Extensive experience leading complex, multi-disciplinary technology programs.

• Deep knowledge of SEMI standards, CE/UL, EMC/EMI, grounding, and safety compliance.

• Demonstrated technical leadership across multiple product generations.

Preferred Qualifications

• Advanced packaging, plasma processing, etch, deposition, or wafer-level packaging experience.

• Strong patent portfolio and innovation track record.

• Experience defining product roadmaps and technology strategy.

• Industry-recognized technical leadership and customer engagement experience.