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Posted 9 days ago

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Senior Radio Frequency Engineer (Contingent)

Oklahoma CityFull-time

AI Summary

Lead the redesign and qualification of High Power Amplifier circuit card assemblies for radar applications, including RF/thermal modeling, requirements engineering, EMI/EMC planning, and vendor coordination.

About this role

  • Lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form‑Fit‑Function‑Interface compatibility
  • Plan and execute measurements of GFP/GFI hardware; derive and verify baseline parameters (gain/flatness, impedance/VSWR, output power, spectral purity, pulse shape/timing)
  • Develop correlated RF and thermal simulation models; evaluate device topologies (BJT/LDMOS/GaN) and output combining networks
  • Author and maintain requirements in MBSE; produce SSS and ICS with full traceability to sources and verification methods
  • Own EMI/EMC and environmental planning; define fixtures and pre‑qualification per applicable standards
  • Prepare and lead SRR/PDR with Government stakeholders; capture minutes, actions, and update RAID log
  • Coordinate U.S. vendor market survey; manage NDAs; integrate supplier inputs on risks, manufacturability, and prototype ROM
  • Collaborate with program management to maintain PMP and IMS; report status, risks, and mitigations
  • Mentor team members; uphold engineering rigor and documentation quality
  • Other duties as assigned

This position is contingent upon contract award.

Requirements

Education/Training:

    • Bachelor’s Degree in relevant engineering or science discipline required
    • Master’s degree preferred

Experience:

    • 8+ years experience designing, testing, and qualifying RF power amplifiers for radar or high‑power pulsed applications (L‑band preferred)
    • Hands‑on experience with BJT/LDMOS/GaN device selection, biasing, matching networks, and microstrip layout
    • Proficiency building high‑fidelity RF and thermal models (e.g., Ansys HFSS/Icepak) and correlating to measured data
    • Requirements engineering using MBSE tools (e.g., Cameo)
    • Authoring System/Subsystem Specifications and Interface Control Specifications
    • EMI/EMC planning and pre‑qualification per MIL‑STD‑461; environmental and ESS testing per MIL‑STD‑810

Security:

    • Must be a US citizen
    • If selected candidate does not have an active Clearance at level Secret or higher, one will be obtained upon hire

Physical Requirements:

    • Able to occasionally reach with hands and arms
    • Prolonged periods of computer screen use, while sitting or standing at a desk
    • Adhere to safety protocols when in work areas requiring use of PPE (e.g. eyewear, gloves, masks, hearing protection, steel toed shoes, etc.)
    • Able to safely lift and carry up to 20 pounds at a time

Benefits

  • Health Care Plan (Medical, Dental & Vision)
  • Retirement Plan (401k, IRA)
  • Life Insurance (Basic, Voluntary & AD&D)
  • Paid Time Off (Vacation, Sick & Public Holidays)
  • Short Term & Long Term Disability
  • Training & Development
  • Wellness Resources

Salary: $135,000 - $150,000

Salary rates for this position are competitive and commensurate with experience and industry standards. We offer a comprehensive benefits package that may include health insurance, paid time off, and retirement savings options.

Skills

Ansys HFSSAnsys IcepakBJT/LDMOS/GaN Device SelectionEMI/EMC Pre-qualificationImpedance MatchingMBSE (Cameo)Microstrip LayoutMIL-STD-461MIL-STD-810PMPPulse Shape/timing MeasurementRF Power Amplifier DesignSpectral Purity AnalysisSSS And ICS AuthoringThermal SimulationVendor Market SurveyVSWR Measurement

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