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Posted 15 days ago
Technical Program Manager (MCL)
TaipeiOn-siteFull-time
AI Summary
Manages technical programs for electronic packaging and chip cooling solutions, coordinating with OSATs, ODMs, and chip vendors to deliver high-quality, reliable products.
About this role
Preferred
- Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution.
- Prior experience in electronic packaging industry and/or chip design industry
- Established relationships within OSATs, ODMs and/or chip vendors
Skills & Attributes
- Highly analytical and strategic thinker with quality and reliability of product in mind
- Skilled in DFx (x = manufacturability, reliability, and/or test)
- Comfortable in operating with ambiguity in fast‑evolving technology markets
- Excellent communication skills in English; Mandarin proficiency strongly preferred
Skills
Chip Cooling SolutionsChip Package DesignChip VendorsDFxElectronic PackagingManufacturabilityODMOSATQuality And ReliabilityReliability EngineeringTest Engineering
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Market data for this role
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- SeriesSalary reportsWhat employers publish in job postings, by level and workplace. Not self-reported pay.
- Market overviewState of tech hiring, September 2026: up 4.8%Tech hiring rose 4.8% month over month in September 2026, with 411,122 new listings. Customer support and account executive roles led the growth.