Technology Development Process Integrator Engineer

onsemi is seeking a highly motivated engineer to work in our Technology Development group as a Process Integrator on Image Sensor technologies. This will include driving continuous improvement on new processes, new pixel architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing.

Qualifications

Required Qualifications:

• Education: BS in Engineering or Materials Science
• Experience: 2-4+ years of relevant experience in semiconductor manufacturing integration and technology development.
• Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
• Language Fluency – Fluent in English Language, written & verbal

Salary: onsemi is excited to share the base salary range for this position is $102,600 to $179,600 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf

Responsibilities

Essential Responsibilities:

• Support new product development from the development phase through manufacturing, including full documentation to support ONSEMI’s process change review.
• Ability to work well within a global, matrixed team and drive projects and results independently.
• Ability to communicate effectively with all levels of the organization, including executive staff.
• Ability to operate independently and translate high-level objectives into detailed execution plans.
• A team player with strong listening skills who can take input and make informed decisions.
• Demonstrated understanding of Semiconductor technology, manufacturing, new product development, device, and Yield improvement.
• Ability to use Probe, In-line test, and Failure analysis data to champion and follow through with process changes.
• Proven experience and deep knowledge of Image Sensor technology, as well as Pixel architecture and device performance, are highly preferred.
• Broad, cross-functional experience in semiconductor development and manufacturing is preferred, with specialization in Image Sensors highly desirable.
• Specific skills in BEOL Cu integration, Hybrid Bonding, optical film stack deposition, and Back-Side Illumination integration.
• Proficiency in SW tools such as MS Excel, PowerPoint, Word, MS Project, and Yield analysis tools such as Shiny, Excensio, JMP, etc.
• Drove cost reduction through yield enhancement and process simplification