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Thermal Design Engineer

AustinHybrid

AI Summary

Design cooling systems for a photonic wafer-scale platform, addressing unique thermomechanical challenges in high power density and high TDP environments.

About this role

What We’re Looking For:

We’re looking for thermal design engineers to build the cooling system for our photonic wafer-scale system.

This involves unique thermomechanical challenges and will require solving problems differently than traditional high power density sleds/trays.



Ideal Background:

  • Experience with liquid cooled systems
  • Experience with higher TDP and high power density systems
  • Deep understanding of thermal bottlenecks in high power dissipation and high power density systems
  • Ability to innovate and solve problems that are different than a few % improvement in known KPIs

Nice to Have:

  • Experience with systems where the TIM is the primary performance bottleneck
  • Experience with advanced and/or emerging TIM materials
  • Experience with multi-TIM systems
  • Experience with large physical size IC advanced package assembly cooling problems
  • Experience with rack-scale systems

Skills

Advanced TIM MaterialsHigh Power Density Thermal DesignHigh TDP SystemsIC Advanced Package Assembly CoolingLiquid CoolingMulti-TIM SystemsRack-scale CoolingThermal Bottleneck AnalysisThermal Interface Materials (TIM)Thermomechanical Analysis

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