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Alice & Bob

Posted 14 days ago

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3D Integration Engineer H/F

AubervilliersHybrid

AI Summary

Senior 3D Integration Engineer responsible for identifying, benchmarking, and qualifying 3D assembly technologies for superconducting quantum processing units, including airbridges, flip-chip bonding, TSV, and multi-layer wiring, while collaborating across fabrication, packaging, and external foundries.

About this role

Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems.
The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈‍⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously!
We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together!

Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems.
The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈‍⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously!
We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together!

We are seeking a Senior 3D Integration Engineer H/F to join the Process Integration team within the Quantum Hardware & Infrastructure department.

This position sits at the intersection of nanofabrication, assembly and scalable QPU design, working closely with teams across the hardware organization — from roadmap to fabrication, packaging, and validation.

Responsabilities

  • Identify and benchmark enabling 3D assembly technologies for QPUs in accordance with superconducting-circuit constraints: material/process compatibility, microwave performance, and cryogenic reliability
  • Develop and qualify the 3D integration building blocks — airbridges, flip-chip bonding, TSV, multi-layer wiring (MLW), superconducting interconnects, and wafer-level assembly — in close collaboration with fabrication and packaging teams
  • Develop and coordinate integration test plans in collaboration with cross-functional teams
  • Establish scalable, well-documented integration procedures to support system growth
  • Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and overall performance targets
  • Act as the technical point of contact for 3D integration with external foundries, packaging partners, and equipment vendors, in close collaboration with our foundry partnerships expert

    • Requirements

  • PhD or MSc in physics, materials science, electrical engineering, or microelectronics, with strong hands-on cleanroom experience
  • 3+ years of demonstrated 3D integration experience, in flip-chip / bump bonding and TSV processing.
  • Proven track record of developing and qualifying an integration process brick end to end — from literature survey and test-vehicle design through experiments, data analysis, and go/no-go decision
  • Solid grounding in failure analysis and reliability assessment of 3D interconnects: cross-sectioning, SEM, X-ray inspection / tomography, profilometry, electrical test structures
  • Understanding of superconducting QPU fabrication and of what cryogenic operation demands from materials and interfaces is a plus

    • Recruitment process

  • Screening Call with Alexandra Talent Acquisition Specialist (30 min)
  • Hiring Manager Interview with the Hiring Manager (45 min)
  • Technical Interview/Presentation with the Team (90 min)
  • Leadership and Fit Interview (60 min)

    • Skills

    3D IntegrationAirbridgesBump BondingCleanroom ProcessesCross-sectioningCryogenic ReliabilityElectrical Test StructuresFailure AnalysisFlip-chip BondingMicrowave PerformanceMulti-layer Wiring (MLW)ProfilometryReliability AssessmentSEMSuperconducting-circuit ConstraintsSuperconducting InterconnectsTSV (through-silicon Via)Wafer-level AssemblyX-ray Inspection / Tomography

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