Posted 4 months ago
Assembly Technical Program Manager
AI Summary
Leads cost transformation and process innovation across NXP's semiconductor assembly operations, driving BOM optimization, leadframe packaging advancements, and supplier collaboration to achieve breakthrough cost reductions and manufacturing efficiency.
About this role
Role Summary
• This role is responsible for driving cost competitiveness, process efficiency and BOM competitiveness across NXP’s assembly operations. This role leads strategic initiatives to achieve breakthrough cost reductions, enhance manufacturing efficiency, and enable next-generation package architectures in close collaboration with suppliers, material innovation and Business Lines (BL).Job Responsibility
1.Package Cost Transformation Leadership
- Drive package cost breakthroughs through:
- Low-cost Bill of Materials (BOM) optimization
- Assembly process cost reduction and automation
- Lead QFN cost transformation programs, focusing on design-to-cost and manufacturability
2.Operation Process Innovation
- Lead development and implementation of super wide leadframe / high-density packaging solutions
- Champion innovations in molding process efficiency, mold cleaning cost reductions
3.People Management and Program Management
- Coaching and Engineer technical compe6.tency improvements
- Program Management in a matrix organization
4.Strategic Supplier Engagement
- Partner with key assembly material and equipment to:
- Co-develop innovative, cost-effective BOM, 2nd source, alternative BOM
- Accelerate adoption of new materials and process technologies
5.Business Line (BL) & Stakeholder Management
- Lead cross-functional engagement with BLs on BOM changes and PCN success rate
6.Change Management & Governance
- Establish structured governance for cost and technology change programs
- Ensure robust risk assessment, qualification, and validation processes
- Drive data-driven decision-making and transparency across stakeholders
Job Qualification
• Bachelor’s or Master’s degree in Electronics, Electrical, Mechanical, Materials Engineering, or a related field.
• 10–18+ years in semiconductor assembly / packaging engineering
• Proven leadership in:
Cost reduction and value engineering programs
QFN back end, in strip solutions and leadframe-based package technologies
Strong track record in Driving cross-site or global initiatives & Supplier collaboration and negotiation
• Technical Expertise
Deep knowledge of Assembly processes especially Back end Leadframe design and high-density packaging
Cost modeling (BOM + process cost structures)
Experience in Molding process optimization
Familiarity with PCN processes, JEDEC standards, and qualification flows
• Leadership & Competencies
Strategic thinker with strong cost engineering mindset
Influential leader capable of driving alignment across BLs and suppliers
Strong analytical and problem-solving capability
Proven ability to lead change in complex, matrix organizations
Excellent communication skills with executive-level stakeholder management
Skills
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