Board Support Package (BSP) Firmware Engineer

Overview

Join our embedded systems team as a board-level firmware engineer, where you'll own the complete Board Support Package (BSP) lifecycle for next-generation consumer wearable devices. Working at the intersection of hardware and software, you'll be responsible for powering up prototypes, enabling new SoC silicon, and delivering robust software platforms for various consumer electronics wearables and AI devices. Your contributions will be instrumental in bringing innovative hardware to life from the earliest prototypes through mass production.

Responsibilities

• Lead board bring-up for new hardware: power sequence, initialize clocks, configure boot media, and enable SoC subsystems for prototype and production boards.
• Develop, port, and maintain BSP components, including bootloaders, kernel, device drivers, device tree, memory, power domains, and peripheral configurations.
• Enable and validate core wearable subsystems such as PMIC, battery charging, camera/image sensors (MIPI CSI-2), wireless (Bluetooth, BLE, Wi-Fi, GPS/GNSS,), audio (I2S/PDM/SoundWire/codecs/MEMS microphones), display/touch interfaces, and variety of sensors (I2C/SPI).
• Build and maintain diagnostic tooling: board test firmware, debug utilities, diagnostic images, logging frameworks, crash analysis tools, and robust firmware update/recovery mechanisms.
• Interface directly with SoC and component vendors: integrate reference code, resolve errata, provide feedback on datasheets, and participate in schematic/layout reviews.
• Support EVT/DVT/PVT and mass production builds on-site and at contract manufacturers: prepare bring-up/test plans, lead board checkout, triage system bring-up failures, and conduct root cause investigations.
• Provide cross-functional support to application, systems, and test teams as the hands-on expert for board-level debugging and issue resolution.
• Produce comprehensive documentation for bring-up procedures, board validation, driver interfaces, and known issues to enable efficient handover to downstream product teams.

Minimum Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent industry experience.
• 3+ years developing embedded firmware or BSPs for ARM-based SoCs or microcontrollers, delivering code in shipping hardware products.
• Advanced proficiency in C for embedded systems; experience with ARM assembly and scripting (Python or shell) for tooling and automation.
• Track record of successful board bring-up from bare PCB to functional prototype, including power sequencing, bootloader configuration, and subsystem enablement.
• Proven hands-on driver development using standard buses and protocols: I2C, SPI, UART, USB, SDIO, I2S/PDM, MIPI CSI/DSI, GPIO/interrupt handling.
• Proficient with embedded Linux (including Yocto/Buildroot, device tree, and kernel device drivers) and/or RTOS environments (Zephyr, FreeRTOS, vendor RTOS).
• Experience with bench instruments (oscilloscope, logic/protocol analyzers, DMM, JTAG/SWD, power analyzer) for low-level hardware debug and system validation.
• Ability to interpret schematics, block diagrams, and datasheets, and communicate technical details effectively with hardware engineering teams.
• Comfortable working with lab prototypes and traveling occasionally for manufacturing or partner site support.

Preferred Qualifications

• Experience delivering firmware/BSP for shipping consumer wearables or other battery-powered, space-constrained devices (e.g., smart glasses, fitness/health devices, earbuds, watches).
• Advanced domain expertise in at least one area: camera/image subsystem tuning, low-power wireless coexistence, audio pipelines, or battery fuel gauging/charging.
• Familiarity with low-power system design, including microamp-level standby measurement and optimization techniques.
• Exposure to platform security concepts and flows: secure boot, key provisioning, firmware signing, and OTA update frameworks.
• Experience supporting NPI at a contract manufacturer, with hands-on involvement in factory test, calibration workflows, and high-yield manufacturing release.
• Familiarity with hardware-in-the-loop automated testing and implementing CI pipelines for firmware validation.