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Open since Feb 2026

Device and Process Integration EngineerTexas Instruments · Lehi

Device and Process Integration Engineer

LehiOn-siteFull-time

AI Summary

Drives process and parametric improvements for analog and embedded technologies in a 300mm wafer fab, leading cross-functional teams on characterization, experiments, and data analysis. Owns parametric Cpk performance and transfers new technology into production.

About this role

Change the world. Love your job.
Texas Instruments is looking for an energetic engineer with a passion for process technology. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved process technologies in a state-of-the-art, growing 300mm analog and embedded wafer fab in Lehi, Utah.


The responsibilities of a Process Integration Engineer in this role include:

  • Utilize technical knowledge of semiconductor device physics to enable competitive technology through process and parametric improvements
  • Drive process and device improvements through characterization, test, design of experiments, data analysis and simulation
  • Ownership of technology parametric performance, parametric Cpk improvements
  • Parametric test dispositions including root cause determination for scrap or outliers, definition and evaluations of experiments to improve processes
  • Product flow creation/review
  • Short flow development
  • Cross functional team leadership to support the transfer, development, qualification, and manufacturing of advanced analog and embedded technologies.
  • Work with multiple process, integration, reliability, packaging and test engineers to achieve goals
  • Work closely with the product groups to identify and optimize the process performance to meet critical final device parameters to enable game changing products in the market

The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.

Qualifications

Minimum requirements:

  • 5 years relevant experience
  • Masters or PhD in EE/ECE or semiconductor specific: solid state physics, applied physics or quantum mechanics
  • 5 years of experience working in a semiconductor factory with specific experience in advanced planar CMOS semiconductor devices and transition of new technology from introduction to production on schedule


Preferred qualifications:

  • Demonstrated technical and practical understanding of advanced planar CMOS semiconductor device physics and integration
  • Experience in circa 28nm process technology node
  • Ability to work effectively in a fast-paced and rapidly changing environment
  • Demonstrated strong analytical and problem-solving skills
  • Strong verbal and written communication skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Strong time management skills that enable on-time project delivery
  • Demonstrated ability to build strong, influential relationships
  • Ability to take the initiative and drive for results

Skills

28nm Process Technology300mm Wafer FabAdvanced Planar CMOSCpk AnalysisData AnalysisDesign Of ExperimentsDevice SimulationParametric TestProcess CharacterizationProcess IntegrationProduct Flow ReviewRoot Cause AnalysisSemiconductor Device PhysicsShort Flow Development

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