Process Integration Engineer (R&D)

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Texas Instruments is looking for an experienced engineer with a passion for process technology development. This position provides the opportunity to drive leading-edge technology development for our embedded and analog businesses. Our team is primarily focused on developing 28nm and 22nm process technologies in a state-of-the-art, growing 300mm analog and embedded wafer fab in Lehi, Utah.

The responsibilities of a Process Integration Engineer in this role include:

• Apply semiconductor device physics and model-based problem solving to help resolve complex integration issues and support parametric and yield improvements
• Support development of sections of the process flow by helping define process requirements, specifications, and technical success criteria
• Drive process and device improvements through characterization, test, design of experiments (DOE), data analysis, and simulation
• Work with experienced engineers to apply process-integration best-known methods (BKMs) for advanced CMOS technology nodes below 28nm
• Partner with process, integration, reliability, packaging, and test engineering teams to deliver program goals
• Work closely with product groups to optimize process performance to meet critical final device parameters and enable differentiated products in the market

The person performing this role should be able to plan effectively, manage multiple technical tasks in parallel, meet critical deadlines, contribute to technical discussions in their area of expertise, and work effectively across organizational boundaries. They should be able to clearly communicate project status and actions, interface effectively with multiple organizations, and work well on a diverse team to accomplish goals.

Qualifications

Minimum requirements:

• Master’s in Electrical Engineering, Electrical and Computer Engineering, or a semiconductor-focused discipline such as solid-state physics, applied physics, or a related field
• 3+ years of experience working in a semiconductor factory environment, including experience in advanced CMOS technology development, preferably with HKMG expertise, for technology nodes below 28nm
• Demonstrated strength in DOE, data analysis, and translating learning into process and parametric improvements

Preferred qualifications:

• Demonstrated ability to build strong working relationships with key stakeholders, internally and externally
• Strong technical communication and cross-functional technical leadership skills
• Ability to ramp quickly on new systems, tools, and processes
• Strong interpersonal, analytical, and problem-solving skills
• Proven ability to collaborate effectively across functions and within diverse teams
• High ownership mindset: takes initiative and drives for results
• Strong time-management and prioritization skills, with a track record of on-time project delivery