
Posted 10 days ago
Physical Verification & Signoff Engineer
AI Summary
Owns physical verification and reliability signoff for silicon tapeouts, running DRC/LVS/ERC/antenna checks and IR/EM analysis, debugging violations, managing foundry deliverables, and building automation to help AI triage signoff issues.
About this role
About Voltai
Voltai is developing world models, and agents to learn, evaluate, plan, experiment, and interact with the physical world. We are starting out with understanding and building hardware; electronics systems and semiconductors where AI can design and create beyond human cognitive limits.
About the Team
Backed by Silicon Valley’s top investors, Stanford University, and CEOs/Presidents of Google, AMD, Broadcom, Marvell, etc. We are a team of previous Stanford professors, SAIL researchers, Olympiad medalists (IPhO, IOI, etc.), the inventors of IC3 and the Murphi verification system, CTOs of Synopsys & GlobalFoundries, Head of Sales & CRO of Cadence, former US Secretary of Defense, National Security Advisor, and Senior Foreign-Policy Advisor to four US presidents.
About this Role
You'll be the last line of defense before tapeout. You'll own physical verification and reliability signoff on real silicon programs with leading semiconductor companies while helping Voltai's AI learn to find and fix signoff issues.
What You’ll Do
Own DRC, LVS, ERC, and antenna signoff at block and full-chip level.
Run and sign off IR drop, electromigration, and power integrity analysis.
Debug and drive fixes for signoff violations with physical design teams.
Manage tapeout checklists and foundry deliverables.
Build automation for signoff runs, triage, and reporting.
Help define how AI can triage and fix signoff violations.
What We’re Looking For
5+ years of physical verification or signoff experience on production tapeouts.
Deep experience with Calibre or IC Validator.
Experience with RedHawk or Voltus for IR/EM analysis.
Strong understanding of foundry rule decks at advanced nodes.
Tcl, Python, or SVRF scripting.
Bonus Points
Experience with 2.5D/3D packaging or chiplet integration signoff.
Direct foundry interface experience.
Interest in AI-assisted design tools.
Skills
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