Posted 9 days ago
Principal Application Engineer
AI Summary
Builds and supports Cadence thermal simulation workflows for 2.5D/3D IC, package, PCB, and electronic products, driving customer engagements and collaborating with R&D to enhance tool capabilities.
About this role
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Job Description
Position Responsibilities:
- Work closely with customers to build up Cadence thermal simulation flow for 2.5D/3D-IC/package/PCB/electronic products.
- Drive customer technical engagements through onsite support, product demonstrations, technical training, and workshops.
- Gather customer feedback on new application scenarios and challenging thermal problems, and collaborate with the R&D team to enhance tool functionality, performance, and competitiveness.
- Establish technical credibility and professional rapport with customers, ensure high-quality customer service and project delivery.
Position Requirement:
- Bachelor’s degree in Thermal Physics, Mechanical Engineering or related field. Master’s preferred.
- 3+ years related experience in thermal simulation/design and electronic cooling field.
- Familiar with thermal simulation tools. Experience in mechanical simulation tools is a plus.
- Basic knowledge of scripting languages like Python for thermal simulation automation is a plus.
- Excellent team-worker and high performance with self-driven/self-learning capability.
- Able to communicate effectively in spoken and written English.
- Strong customer-oriented mindset and problem-solving ability.
We’re doing work that matters. Help us solve what others can’t.
Skills
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- Market overviewState of tech hiring, September 2026: up 4.8%Tech hiring rose 4.8% month over month in September 2026, with 411,122 new listings. Customer support and account executive roles led the growth.